Yap.  The flatness of the center pads is better than the edge, just in case you have some exposed copper at the edge, that will harden the gold locally. 
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Aug 04 11:36:30 2009
Subject: [TN] Wire bond

Good Morning,

Does the size of a wire bond pad (in this case with a perfect etch .002 wide) have any effect on whether the wire bonder does Al wedge or Thermosonic gold( I know the gold plating is different) - just asking about the process. Thanks. Steve Kelly



Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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