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Subject:
From:
"Jeremias, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeremias, Michael
Date:
Tue, 4 Aug 2009 18:14:56 +0200
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text/plain
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text/plain (1 lines)
 Lieber Herr Engelmaier,

In der J-STD-001 steht:

3.9.3 Gold Removal Gold shall13 be removed:



• From at least 95% of the surface to be soldered of the through-hole component leads with 2.5 μm [0.0984 mil] or  more of gold.





• From 95% of all surfaces of surface mount components to be soldered regardless of gold thickness.



• From the surface of solder terminals plated with 2.5 μm [0.0984 mil] or more of gold.







A double tinning process or dynamic solder wave may be used for gold removal.





Electroless nickel immersion gold (ENIG) finishes on PCBs are exempt from this requirement.



These requirements may be eliminated if there is documented objective evidence available for review that there

are no gold related solder embrittlement problems associated with the soldering process being used.





(13) Class 1-Not Est

Class 2-Proc Ind

Class 3-Defect





Das heisst ein Zulieferer, der nach  J-STD-001 liefert darf auf den Entgoldungsprozess verzichten, wenn bei  through hole componenten  die Goldschichtstärke unter 2,5 µm z, B  2,4 µm beträgt. Ist das wirklich  so zulässig?



Oder sollen wir unserem Zulieferer vorschreiben  auch bei  kleineren Goldschichtdicken als  2,5 µm zu entgolden.  Sie  schreiben doch, dass selbst bei bei viel kleineren Durchschnittsgrössen als   3wt%  Goldversprödung vorkommen kann. Und mit 2,5 µm Goldschichtstärke lässt sich das in einem engen PTH nicht erreichen, da  die Lofüllung nicht ausreicht.  



Sie  schreiben auch, dass die Gefahr besteht, dass das  Gold  nicht gleichmässig verteilt sein kann.  Das wirkt sich natürlich bei  Feinpitch BAuelemneten  umso mehr aus.  Dann sollte  das auch in den  Normen  so stehen.





 

Sincerly 



Michael Jeremias   

Industrial Engineering (OPPI41) 

Electronics Production 

((( Defence Electronics 

EADS Deutschland GmbH 

89077 Ulm

Tel.: +49 (0) 7 31.3 92-5533

Fax:     +49 (0) 7 31.3 92-73 15

E-Fax: +49 (0) 7 31.3 92-20 5533



-----Ursprüngliche Nachricht-----

Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Werner Engelmaier /*

Gesendet: Dienstag, 4. August 2009 13:44

An: [log in to unmask]

Betreff: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT





 Lieber Herr Jeremias,

1. Es ist nicht leicht ein IEC Dukument zu ändern.

2. Die meistens Länder haben eine Vertretung bei der IEC die für solche Anfragen zuständig sind.

Wie ich schon früher gesagt habe, sind diese Goldgrenzen von 1,6 vol% oder 3 wt% sehr grobe Daumenanpeilungen, und Goldversprödung kann bei viel kleineren Durchschnittsgrössen vorkommen, da in den meisten Fällen das Gold nicht gleichmässig verteilt ist.

Ausserdem, ist diese Goldversprödung nicht eine Ja/NeinSache sondern brigt eine absteigende Gefügeschwächung.



Regards,

Werner Engelmaier

Engelmaier Associates, L.C.

Electronic Packaging, Interconnection and Reliability Consulting

7 Jasmine Run

Ormond Beach, FL 32174 USA

Phone: 386-437-8747, Cell: 386-316-5904

E-mail: [log in to unmask], Website: www.engelmaier.com







 





 



-----Original Message-----

From: Jeremias, Michael <[log in to unmask]>

To: [log in to unmask]

Sent: Tue, Aug 4, 2009 4:09 am

Subject: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT





















Unfortunately, the discussion about the matter is  not  so  serious as the problem.



Proceedings  in  technological quality are  not available  by  (hundreds!) of mails with ridiculous content but by hard work.





1, Who  knows  the responsible  at  IEC or  TC91, who is  able to change it?

2. Who is  able to make  thebchange request?





 

Sincerly 



Michael Jeremias   

Industrial Engineering (OPPI41) 

Electronics Production 

((( Defence Electronics 

EADS D

eutschland GmbH 

89077 Ulm

Tel.: +49 (0) 7 31.3 92-5533

Fax:     +49 (0) 7 31.3 92-73 15

E-Fax: +49 (0) 7 31.3 92-20 5533

P Before printing, think about the environment ! 



mailto: [log in to unmask]

EADS Deutschland GmbH

Registered Office: Ottobrunn

District Court of Munich HRB 107 648

Chairman of the Supervisory Board: Dr. Thomas Enders

Managing Directors: Dr. Stefan Zoller (chairman), Michael Hecht

This E-mail and any attachment(s) to it are for the addressee's use only.

It is strictly confidential and may contain legally privileged information. No 

confidentiality or privilege is waived or lost by any mistransmission.

If you are not the intended addressee, then please delete it from your system 

and notify the sender immediateley. You are hereby notified that any use, 

disclosure, copying or any action taken in reliance on it is strictly prohibited 

and may be unlawful. - Thank you.







 



-----Ursprüngliche Nachricht-----

Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo

Gesendet: Freitag, 31. Juli 2009 19:06

An: [log in to unmask]

Betreff: Re: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A 

SOLDER JOINT



Who ever made doc and approved it should get shot at... seriously.  Not a Friday 

joke. 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeremias, Michael

Sent: Friday, July 31, 2009 12:17 PM

To: [log in to unmask]

Subject: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A 

SOLDER JOINT



Unfortunately it is not (!)=2

0a typo from me . The document  DIN EN  61191-1 

contains  this  value  2,5 µm . But I am not confident, that this   is low 

enough for any process cases so we use  for PTH the same rule as above  as 

mentioned below

Sincerely 



Michael  Jeremias



-----Ursprüngliche Nachricht-----

Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo

Gesendet: Donnerstag, 30. Juli 2009 12:22

An: [log in to unmask]

Betreff: Re: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER 

JOINT



Must be a typo. Should be 0.25 micron? 10 micro-inches? 

--------------------------

Sent using BlackBerry





----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Thu Jul 30 04:26:14 2009

Subject: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT



IEC 61191-1

chapter  6.2.2 contains  the  rules

< 1,4% Volume Au, <  3% Wt Au in the final solder interconnection 

< 2,5 µm for  PTH Wave soldering  (I am not confident, that this   is low enough 

for any process cases so we use  for PTH the same rule as above)



You have to take into consideration solder paste volume(stencil-thickness), 

wetted Au-surface, wetted Au thickness



Own investigations  show, that Au brittelness may  occure from  1,6% Vol and 

really will occure from 2,3% Vol. 



 







Sincerly 



Michael Jeremias   

Industrial Engineering (OPPI41)

Electronics Production

((( Defence Electronics

EADS Deutschland GmbH

89077 Ulm

Tel.: +49 (0) 7 31.3 92-5

533

Fax:     +49 (0) 7 31.3 92-73 15

E-Fax: +49 (0) 7 31.3 92-20 5533

P Before printing, think about the environment ! 



mailto: [log in to unmask]

EADS Deutschland GmbH

Registered Office: Ottobrunn

District Court of Munich HRB 107 648

Chairman of the Supervisory Board: Dr. Thomas Enders Managing Directors: Dr. 

Stefan Zoller (chairman), Michael Hecht This E-mail and any attachment(s) to it 

are for the addressee's use only.

It is strictly confidential and may contain legally privileged information. No 

confidentiality or privilege is waived or lost by any mistransmission.

If you are not the intended addressee, then please delete it from your system 

and notify the sender immediateley. You are hereby notified that any use, 

disclosure, copying or any action taken in reliance on it is strictly prohibited 

and may be unlawful. - Thank you.



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