Hi All,
Given the high interest within the industry in solder joint reliability
in general and given the current difficulties in traveling, I thought
some of you might be interested in three webcasts I will be giving on
this subject on September 15, 16 & 17. for details, please see the
attached IPC announcement.
Unfortunately, IPC stripped its own message, so I copy it below.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
IPC Webcast: Series on Lead-Free Updates
September 15 — 17, 2009
10:00 am-11:00 am (Central time)
tuesday, September 15
Wednesday, September 16
thursday, September 17
The
industry has=2
0grappled with the issue of solder joint reliability for
the last 40 years. It took some 30 years to understand the
creep-fatigue behavior of tin-lead solders. With the RoHS-mandated
switch to lead-free, the reliability issue started anew with SAC alloys
(tin, silver, copper) and other lead-free solders. While you can learn
a lot about the reliability of SAC solders from our experience with
tin-lead solders, there are important differences in both what is
required for successful soldering processes and the way these lead-free
solders behave.
The webcast Series on Lead-Free Updates provides the audience with basic information about underlying solder behavior and failure mechanisms.
Fundamental understanding is essential during the design process, so
that highly reliable assemblies can be manufactured on a repeatable
basis. Failure modes and root cause analysis results will be shared
during the Lead-Free Update webcasts. Lessons learned will help you
manufacture more reliable products using lead-free technology. This
will result in fewer products coming back from the field, improving the
efficiency of operations and reducing penalty costs associated with
returned goods.
Who Should Attend:
This webcast series is recommended for anybody concerned with the
quality and reliability of electronic products, especially solder joint
reliability. The webcasts are especially important for managers and
engineers involved with the desi
gn and manufacture of printed circuit
assemblies.
Fundamentals in Solder Joint Reliability
Tuesday, September 15, 2009
The
switch to lead-free solders has created a number of issues in the
assembly process as well as with the long-term reliability of
assemblies themselves. The threat to the reliability of electronic
products comes from three sources: (1) solder joint reliability, (2)
printed circuit board (PCB) survivability, and (3) component
survivability. The potential damage to assemblies caused by the high
temperatures required for most lead-free soldering processes can have
an enormous effect on assembly integrity and reliability. During this
webcast, various failure modes that have been observed will be highlighted, their underlying damage mechanisms will be defined as well as solution options.
The
properties of lead-free solders, particularly SAC solders, can cause
processing issues, including dissolution of base metals such as copper
& increased stress due to different coefficients of thermal
expansion and higher soldering temperatures. These issues will be
examined together with their possible impacts on solder joint
reliability. Both the short-term and long-term effects will be
discussed during the webcast.
Root Cause Analysis of Solder Joint Failures
Wednesday, September 16, 2009
Stres
s
is the primary root cause of solder joint failure. Higher temperatures
required for the lead-free soldering process create a different
stress-strain relationship than that for traditional leaded solders.
Higher temperatures also stress components and printed circuit boards.
The proper selection of components, boards, solder and process
variables is critically important in the prevention of solder joint
failures. The PCB and component resin systems need to be able to
survive the soldering processes without thermal degradation and
delamination. Assemblies that seemingly have survived the soldering
processes may contain latent defects leading to early field failures.
Many of these latent defects are traced back to processing conditions
during assembly operations. Only if one is aware of possible failures
can one take steps to prevent latent defects.
Solder Joint Reliability for Pb-Free Solders
Thursday, September 17, 2009
Understanding
the physics of solder joint failure mechanisms and the probability of
occurrence with tin-lead solders took more than 30 years to develop.
The available information on the creep-fatigue behavior of lead-free
solders is, as yet, barely adequate for the determination of
acceleration factors and the development of creep-fatigue models for
some SAC solders and inadequate for other lead-free solders.
The
creep-fatigue reliability of SAC solder joints has been shown not to be
dramatically different from th
e reliability of tin-lead solder joints,
at least for accelerated testing. Predicting solder joint reliability
for products can now be done for some of the most common SAC solder
alloys. Accelerated aging fatigue life of the most common SAC alloys is
available and will be presented. For some of the non-standard lead-free
solders, more data need to be developed before fatigue life can be
predicted; however, recommended design considerations can be
implemented today to mitigate the risk of solder joint failure in the
future. This webcast will share some of the actions you can take today
to avoid problems tomorrow.
About the Webcast Instructor:
Werner
Engelmaier has more than 44 years experience in electronic packaging
and interconnection technology. Known as Mr. Reliability in the
industry, he is the president of Engelmaier Associates, L.C., a firm
providing consulting services on reliability, manufacturing and
processing aspects of electronic packaging and interconnection
technology. He serves as chairman of the IPC Product Reliability
Committee.
Registration Information:
Webcast
registrants will receive a link to download the materials along with
the call-in telephone number 24 hours prior to the start of each
webcast. Please feel free to make copies for all participants attending
at your location. Set up a conference room and attend with colleagues
or log
in from the convenience of your home. Audio will be provided via
a conference call phone number and participants will need Internet
access. Remember to check local times to make sure you don't miss a
minute.
The registration fee for each webcast is
$100 for IPC members and $125 for nonmembers. To register, complete
the registration form online or fax it to +1 847-615-5661. Note:
Cancellations must be made one business day prior to the workshop in
order to be eligible for a full refund. If the workshop is cancelled,
participants will receive a full refund. If you are unable to attend,
you may send a coworker in your place.
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