Lieber Herr Jeremias,
1. Es ist nicht leicht ein IEC Dukument zu ändern.
2. Die meistens Länder haben eine Vertretung bei der IEC die für solche Anfragen zuständig sind.
Wie ich schon früher gesagt habe, sind diese Goldgrenzen von 1,6 vol% oder 3 wt% sehr grobe Daumenanpeilungen, und Goldversprödung kann bei viel kleineren Durchschnittsgrössen vorkommen, da in den meisten Fällen das Gold nicht gleichmässig verteilt ist.
Ausserdem, ist diese Goldversprödung nicht eine Ja/NeinSache sondern brigt eine absteigende Gefügeschwächung.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
-----Original Message-----
From: Jeremias, Michael <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Aug 4, 2009 4:09 am
Subject: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
Unfortunately, the discussion about the matter is not so serious as the
problem.
Proceedings in technological quality are not available by (hundreds!) of
mails with ridiculous content but by hard work.
1, Who knows the responsible at IEC or TC91, who is able to change it?
2. Who is able to make thebchange request?
Sincerly
Michael Jeremias
Industrial Engineering (OPPI41)
Electronics Production
((( Defence Electronics
EADS D
eutschland GmbH
89077 Ulm
Tel.: +49 (0) 7 31.3 92-5533
Fax: +49 (0) 7 31.3 92-73 15
E-Fax: +49 (0) 7 31.3 92-20 5533
P Before printing, think about the environment !
mailto: [log in to unmask]
EADS Deutschland GmbH
Registered Office: Ottobrunn
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Managing Directors: Dr. Stefan Zoller (chairman), Michael Hecht
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-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo
Gesendet: Freitag, 31. Juli 2009 19:06
An: [log in to unmask]
Betreff: Re: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A
SOLDER JOINT
Who ever made doc and approved it should get shot at... seriously. Not a Friday
joke.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeremias, Michael
Sent: Friday, July 31, 2009 12:17 PM
To: [log in to unmask]
Subject: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A
SOLDER JOINT
Unfortunately it is not (!)=2
0a typo from me . The document DIN EN 61191-1
contains this value 2,5 µm . But I am not confident, that this is low
enough for any process cases so we use for PTH the same rule as above as
mentioned below
Sincerely
Michael Jeremias
-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo
Gesendet: Donnerstag, 30. Juli 2009 12:22
An: [log in to unmask]
Betreff: Re: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER
JOINT
Must be a typo. Should be 0.25 micron? 10 micro-inches?
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Jul 30 04:26:14 2009
Subject: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
IEC 61191-1
chapter 6.2.2 contains the rules
< 1,4% Volume Au, < 3% Wt Au in the final solder interconnection
< 2,5 µm for PTH Wave soldering (I am not confident, that this is low enough
for any process cases so we use for PTH the same rule as above)
You have to take into consideration solder paste volume(stencil-thickness),
wetted Au-surface, wetted Au thickness
Own investigations show, that Au brittelness may occure from 1,6% Vol and
really will occure from 2,3% Vol.
Sincerly
Michael Jeremias
Industrial Engineering (OPPI41)
Electronics Production
((( Defence Electronics
EADS Deutschland GmbH
89077 Ulm
Tel.: +49 (0) 7 31.3 92-5
533
Fax: +49 (0) 7 31.3 92-73 15
E-Fax: +49 (0) 7 31.3 92-20 5533
P Before printing, think about the environment !
mailto: [log in to unmask]
EADS Deutschland GmbH
Registered Office: Ottobrunn
District Court of Munich HRB 107 648
Chairman of the Supervisory Board: Dr. Thomas Enders Managing Directors: Dr.
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