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August 2009

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TechNet E-Mail Forum <[log in to unmask]>, ?? <[log in to unmask]>
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Tue, 4 Aug 2009 17:13:51 +0800
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Hi, Mickey

A 3/3mil width/spacing trace needs a 9mil via2via airgap, so the via pad needs to be 17mil with an 8mil hole size. 

Anyway, the balance of PCB layer adding and the using of blind vias is an interesting matter, consider the power will not be isolated.

B.R.
Li Yi
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----- Original Message ----- 
From: "weiner, mickey" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 04, 2009 3:18 PM
Subject: Re: [TN] Looking for a fabricator for a .65mm bga brd


Barbara,
A Via pad is required in the center of every 4 pads.
The diagonal space between 2 bga pads with .25 mm dia. leaves 0.67 mm.
Minimum via pad dia. - see also Dwight response-  would be .46 mm
leaving  0.1 mm (4 mils) via2bgapad distance.
This can be done - but highly not recommended . With Inner via pad the
same size you get 7.5 mils between 2 adjacent via pads  - enough for 1
trace  3 mils wide only.You should calculate the escapes for all your
signals + plane layers to find how many layers you'll need.
I suggest you search the Amkor web site they have good design
application notes.
 
Mickey
 

  _____  

From: Barbara Burcham [mailto:[log in to unmask]] 
Sent: Monday, August 03, 2009 7:17 PM
To: weiner, mickey
Subject: Re: [TN] Looking for a fabricator for a .65mm bga brd


Hi Mickey,
The matrix is full. Pad size recommended is .3mm and am considering a
.25mm pad...the balls on the part are collapsible so that makes me a
smidge nervous. Should I be?
Thanks for any suggestions,
Barbara


On Mon, Aug 3, 2009 at 10:05 AM, weiner, mickey
<[log in to unmask]> wrote:


Barbara,
Is 0.65 mm  the pitch? Is it a full matrix ?  what's the
recommended
pad size
I doubt if under 0.8 mm pitch you'll manage without blind vias


Mickey r


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barbara
Burcham

Sent: Monday, August 03, 2009 5:23 PM
To: [log in to unmask]
Subject: [TN] Looking for a fabricator for a .65mm bga brd


I am working on a layout that has a 0.65mm 14x14 matrix bga on
an 0.062
thick board. I have to be able to place through hole vias
between the
pads.
Would love to use 3 and 3 spacing.
Who out there can advise me about this?
Yes, the board HAS to be 0.062 thk...has a card edge
connector...but can
be on the low side of that.
Yes, we really want to use through hole vias.
We can use 1/2 oz copper on all 8 layers.
The board is small and can easily be run on a smaller production
panel
to improve tolerances.
So, how small a capture pad and hole can be done in a production
environment, reliably?
Need to get this nailed down today.

Barbara Burcham, C.I.D.
pcb Trace Design
281-341-7539 Wk/Hm
713-249-7718 Cell
[log in to unmask]


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-- 
Barbara Burcham, C.I.D.
pcb Trace Design
281-341-7539 Wk/Hm
713-249-7718 Cell
[log in to unmask]


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