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August 2009

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Subject:
Re: IPC-SM-840C
From:
"Bush, Jeffrey D. (US SSA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bush, Jeffrey D. (US SSA)
Date:
Thu, 27 Aug 2009 16:18:29 -0400
Content-Type:
text/plain
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text/plain (51 lines) 
Only EPR are met - adhesion, dimensional, performance (over exposure can cause performance issues beyond undercut. 

Likely the undercut issues is due to exposure energy not getting to the board/mask interface level - contributions to this can also be contributed to by the tack bake process controls.


Jeffrey Bush
Sr. Principle Product Assurance Engineer
Space Systems and Electronics - Performance Excellence
BAE SYSTEMS 
P.O. Box 868, MER24-116A
Nashua, NH 03061-0868
Facility: 144 DW Highway 
Merrimack, NH 03054
Office +1 603.885.8137
Mobile +1 603.318.8056
Fax +1 603.885.5258


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, August 27, 2009 3:22 PM
To: [log in to unmask]
Subject: [TN] IPC-SM-840C

Fellow TechNetters:

   I was not able to finding reference to severe solder mask
undercut/over exposure and what is acceptable.

Vic,

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