Two thoughts from the American Welding Society: Soldering Handbook. 

The flux activation temperature is often overlooked vis-à-vis the solder
alloy  melting temperature when developing a soldering process. For example,
low melting temperature solders . . . may experience poor solderability when
used with rosin-based fluxes because the process temperatures are actually
below the activation temperature of the flux. 

The handbook does not recommend, in general prolonged hold times for a
variety of reasons. 



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Thursday, August 27, 2009 2:34 PM
To: [log in to unmask]
Subject: [TN] Soldering tin-bismuth alloys

Technetters,

 

Anyone have experience using tin-bismuth solder?

Should the dwell time at TAL+20° in my reflow profile be longer (compared to
a eutectic SnPb profile) because of the lower peak temperature?

How long should it be for soldering to nickel?

 

Thanks,

Ben


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