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Subject:	Re: Via-in-pad blowing bubbles
From:	"Bush, Jeffrey D. (US SSA)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Bush, Jeffrey D. (US SSA)
Date:	Thu, 27 Aug 2009 08:00:07 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

Sounds like you have voiding in the vias - volatile entrapment and out-gassing during TE.

Jeffrey Bush
Sr. Principle Product Assurance Engineer
Space Systems and Electronics - Performance Excellence
BAE SYSTEMS 
P.O. Box 868, MER24-116A
Nashua, NH 03061-0868
Facility: 144 DW Highway 
Merrimack, NH 03054
Office +1 603.885.8137
Mobile +1 603.318.8056
Fax +1 603.885.5258


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Wednesday, August 26, 2009 9:34 PM
To: [log in to unmask]
Subject: [TN] Via-in-pad blowing bubbles

Hello netters-

Have we a term for vias-in-pad blowing solder ball bubbles to the point of bridging?
Regardless, is there a unique cure for the problem?
I wonder because- how does one get just enough pressure to blow the large bubble, but not blow-out?   Bad luck?
Or is it not that unusual, and just usually gets screened before it gets to me?

Chris


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