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August 2009

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Subject:
Via-in-pad blowing bubbles
From:
Chris Mahanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Mahanna <[log in to unmask]>
Date:
Wed, 26 Aug 2009 21:34:15 -0400
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text/plain
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Hello netters-

Have we a term for vias-in-pad blowing solder ball bubbles to the point of bridging?
Regardless, is there a unique cure for the problem?
I wonder because- how does one get just enough pressure to blow the large bubble, but not blow-out?   Bad luck?
Or is it not that unusual, and just usually gets screened before it gets to me?

Chris


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