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Date: | Tue, 25 Aug 2009 18:59:53 -0400 |
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O.K,
but why do it in the first place?
Werner
-----Original Message-----
From: Vladimir Igoshev <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Aug 25, 2009 6:00 pm
Subject: Re: [TN] x-ray to estimate solder voiding
Inge,
I wouldn't say that prying off a component is the best way to study
voids. I think that grinding off either the substrate or the
component can be much more efficient.
--
Best regards,
Vladimir mailto:[log in to unmask]
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
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