Kevin, if  you can sacrifice a sample, preying off the component is a way to 
get a very exact way to study voids. If the voids are adjacent to the solder 
pad, which is often the case, the separation use to be just there. Very 
large components, e.g. superBGAs, can not be removed this way, of course.
Inge

----- Original Message ----- 
From: "Glidden, Kevin" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 25, 2009 8:29 PM
Subject: [TN] x-ray to estimate solder voiding


I am looking to have a couple of PCBs x-rayed to estimate the solder voiding 
on the bottom only center pad of an SMT component.  Can anyone recommend a 
place?
Off line answers OK.
Thank you,

Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.
Lebanon, NH 03766

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