Barbara,
Is 0.65 mm the pitch? Is it a full matrix ? what's the recommended
pad size
I doubt if under 0.8 mm pitch you'll manage without blind vias
Mickey r
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barbara Burcham
Sent: Monday, August 03, 2009 5:23 PM
To: [log in to unmask]
Subject: [TN] Looking for a fabricator for a .65mm bga brd
I am working on a layout that has a 0.65mm 14x14 matrix bga on an 0.062
thick board. I have to be able to place through hole vias between the
pads.
Would love to use 3 and 3 spacing.
Who out there can advise me about this?
Yes, the board HAS to be 0.062 thk...has a card edge connector...but can
be on the low side of that.
Yes, we really want to use through hole vias.
We can use 1/2 oz copper on all 8 layers.
The board is small and can easily be run on a smaller production panel
to improve tolerances.
So, how small a capture pad and hole can be done in a production
environment, reliably?
Need to get this nailed down today.
Barbara Burcham, C.I.D.
pcb Trace Design
281-341-7539 Wk/Hm
713-249-7718 Cell
[log in to unmask]
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
CONFIDENTIALITY
This e-mail message and any attachments thereto, is intended only for use by the addressee(s) named herein and may contain legally privileged and/or confidential information. If you are not the intended recipient of this e-mail message, you are hereby notified that any dissemination, distribution or copying of this e-mail message, and any attachments thereto, is strictly prohibited. If you have received this e-mail message in error, please immediately notify the sender and permanently delete the original and any copies of this email and any prints thereof.
ABSENT AN EXPRESS STATEMENT TO THE CONTRARY HEREINABOVE, THIS E-MAIL IS NOT INTENDED AS A SUBSTITUTE FOR A WRITING. Notwithstanding the Uniform Electronic Transactions Act or the applicability of any other law of similar substance and effect, absent an express statement to the contrary hereinabove, this e-mail message its contents, and any attachments hereto are not intended to represent an offer or acceptance to enter into a contract and are not otherwise intended to bind the sender, Sanmina-SCI Corporation (or any of its subsidiaries), or any other person or entity.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
