TECHNET Archives

August 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Barbara Burcham <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barbara Burcham <[log in to unmask]>
Date:
Mon, 3 Aug 2009 09:22:59 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
I am working on a layout that has a 0.65mm 14x14 matrix bga on an 0.062
thick board. I have to be able to place through hole vias between the pads.
Would love to use 3 and 3 spacing.
Who out there can advise me about this?
Yes, the board HAS to be 0.062 thk...has a card edge connector...but can be
on the low side of that.
Yes, we really want to use through hole vias.
We can use 1/2 oz copper on all 8 layers.
The board is small and can easily be run on a smaller production panel to
improve tolerances.
So, how small a capture pad and hole can be done in a production
environment, reliably?
Need to get this nailed down today.

Barbara Burcham, C.I.D.
pcb Trace Design
281-341-7539 Wk/Hm
713-249-7718 Cell
[log in to unmask]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2