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August 2009

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Crawford <[log in to unmask]>
Date:
Wed, 19 Aug 2009 13:05:05 -0500
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Jon, the reliability issue is that the solder, even though it is wiped smooth, oxidizes so much faster than gold contacts, and you'll end up with an open or intermittent connection.

Jack


Jack Crawford, IOM
IPC Director Certification and Assembly Technology
[log in to unmask]
847-597-2893
FAX  847-615-5693
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1)
Sent: Tuesday, August 18, 2009 2:05 PM
To: Listserv Technet
Subject: [TN] INTERPRETATION ON IPC-C-610 D SECTION 10.1

I have had two responses and one suggested I post the following information on reasons for asking the first questions.

 

 

We have an issue on a SMT connector on a Rigid board part of a Flex PWB that solder wicks up inside the female contacts and causes mating issues. But if the mating connector is mated several times it causes the solder in female to distort to fit the male pin end and then it seems to fit. We are concern that the solder is touching the gold male pin at the end and wanted to know does that violate 10.1 and can it cause reliability issues later.  Jon

 


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