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August 2009

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Fri, 14 Aug 2009 11:49:52 +0100
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Inge
I would think any ceramic package device has got to be more expensive than
polymer.
Also it may simply be human factor. 
- If you got your design rules all set up and know about particular devices,
and you look at these, a bit scary?
As its Friday ....
I read somewhere that to succeed you need a three letter acronym, IBM ICA
for example, so on that basis CCGA is doomed. There is a (probably
apocryphal) story about a bloke who started a company called NNC Inc. When
asked what it meant he said he knew you had to have thee letters -as
described above - but couldn't think of anything suitable to abbreviate, so
NNC stood for No Name Company.

HAGWE

Mike

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: 14 August 2009 08:12
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

There  must be some reason why these excellent components have not been more
universally used. Price or what? Or coplanarity issues, as someone
mentioned?
/Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of G. Sala
Sent: torsdag 13 augusti 2009 17:00
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

IBM  CCGA great technology

CCGA  (an old IBM Guide but very interesting)
https://www-01.ibm.com/chips/techlib/techlib.nsf/techdocs/630AFA7BD7DE3FED87
256C0100558D50/$file/ccga.pdf

The largest CCGA size I worked on, produced by IBM Microelectronic, was
52.5mm X 52.5 mm with 2577 Columns, 1.00 mm column pitch. Four of them on a
Boar, plus other smaller CBGA always IBM made plus other SMDs.
PCB surface finiscing OSP

IBM Column 90/10 attachment/bonding to Ceramic Body:

- Wire type  bonded by 63/37(earliest gen)
- Cast type (expensive solution)
- CLASP  bonded by (63/37 doped alloy) last gen, cheaper then Cast type

According to me CCGA is still considered a strategic package for IBM, even
largest then 52.5 x 52.5 mm 

They are ready also with CuCGA  (Copper Column Grid Array)

http://www.me.binghamton.edu/O.M.R.L/ECTC.pdf


Rework and Replace Large CCGA, requires attention but once the process is
qualified, it is very affordable to do.

Also CCGA  re-Colum  process is not so difficult once you qualified it.


Regards

G. Sala

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