Lee,
I worked on manufacturing this technology about 10 years ago. The key
is a uniform and consistent amount of solder paste applied to each pad
prior to reflow. In brief, we stencil printed the solder paste and then
used a vision system to verify the amount of solder paste on each pad.
If all the pads were acceptable a pick and place machine located the
CGAs and then the CCA was reflowed in a convection IR system. During
reflow the CGAs self-aligned and the height of the package helped make
the cleaning process easier. Great technology, let me know if you have
more questions and good luck.
Regards,
Tom Carroll, CQA, CIT
Supplier Quality Engineer
Boeing Integrated Defense Systems - East Region Supplier Quality
Home Office Phone/FAX: 845-753-5932
Temp Office Phone at Alabama Aircraft Indus Inc (205) 510-4783
Temp Office FAX at AAII (205) 592-0295
Boeing Cell: 215-692-2463
email: [log in to unmask]
> NOTE: This communication may contain privileged or other
confidential information. If you are not the intended recipient, or
believe you have received this communication in error, please do not
print, copy, retransmit, disseminate, or otherwise use the information.
Also, please indicate to the sender that you have received this e-mail
in error, and delete the copy you received. Thank you.
> EXPORT COMPLIANCE STATEMENT:
> "The information contained herein is or may be controlled by the
International Traffic in Arms Regulations (ITAR), 22 CFR 120-130, and
may not be exported, or disclosed to a foreign person, whether in the
United States or abroad, without prior U.S. Government written approval"
-----Original Message-----
From: Lee Whiteman [mailto:[log in to unmask]]
Sent: Tuesday, August 11, 2009 5:03 PM
To: [log in to unmask]
Subject: [TN] HDI AND COLUMN GRID ARRAY PACKAGING
We may be using column grid array packaging with ENIG finished High
Density Interconnect (HDI) boards. Are there any ground rules for using
this type of technology?
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
