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August 2009

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TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
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Wed, 12 Aug 2009 19:03:31 +0200
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OK, I believe you. However, Happy Holden at IBM/Fishkill presented the concept in a way that you got it that IBM was the creator. Like you...He-he
Inge
  ----- Original Message ----- 
  From: [log in to unmask] 
  To: [log in to unmask] ; [log in to unmask] 
  Sent: Wednesday, August 12, 2009 5:40 PM
  Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING


  Hi Inge,
  Common misconception, but IBM did not invent column grid arrays, but Bell Labs did [there are patents to proof it]. The difference is that Bell Labs columns where cast, not soldered wires.
  Werner


  -----Original Message-----
  From: Inge <[log in to unmask]>
  To: [log in to unmask]
  Sent: Tue, Aug 11, 2009 5:42 pm
  Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING


  IBM invented them, but did they ever use them ? 
  Inge 
   
  ----- Original Message ----- From: "David D. Hillman" <[log in to unmask]> 
  To: <[log in to unmask]> 
  Sent: Tuesday, August 11, 2009 11:23 PM 
  Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING 
   
  > Hi Lee - Run............ run for the hills! A Column grid array package is 
  > like having a BGA with coplanarity problems! The CGA are not impossible to 
  > deal with but you do need to make sure that your stencil print operation 
  > and solder paste volume values are repeatable and consistent. Also check 
  > to see that the CGA in the trays do not have bent columns before you 
  > attempt to place them. Good Luck. 
  > 
  > Dave Hillman 
  > Rockwell Collins 
  > [log in to unmask] 
  > 
  > 
  > 
  > 
  > Lee Whiteman <[log in to unmask]> 
  > Sent by: TechNet <[log in to unmask]> 
  > 08/11/2009 04:02 PM 
  > Please respond to 
  > TechNet E-Mail Forum <[log in to unmask]>; Please respond to 
  > [log in to unmask] 
  > 
  > 
  > To 
  > [log in to unmask] 
  > cc 
  > 
  > Subject 
  > [TN] HDI AND COLUMN GRID ARRAY PACKAGING 
  > 
  > 
  > 
  > 
  > 
  > 
  > We may be using column grid array packaging with ENIG finished High 
  > Density Interconnect (HDI) boards. Are there any ground rules for using 
  > this type of technology? 
  > 
  > Lee Whiteman, PMP 
  > Senior Member Engineering Staff 
  > L-3 Communications East 
  > Telephone: (856) 338-3508 
  > FAX: (856) 338-2906 
  > E-Mail: [log in to unmask] 
  > 
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