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Subject:	Re: HDI AND COLUMN GRID ARRAY PACKAGING
From:	Werner Engelmaier /* <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Wed, 12 Aug 2009 12:20:49 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (185 lines)

Hi Dewey,

Neither fishing nor casting--I had nothing to do with the development, I just did they reliability testing and analysis, John Fischer at ERC-Princeton developed this technology.

Werner


-----Original Message-----
From: Whittaker, Dewey (EHCOE) <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; [log in to unmask]
Sent: Wed, Aug 12, 2009 12:15 pm
Subject: RE: [TN] HDI AND COLUMN GRID ARRAY PACKAGING




In Werner's fishing for compliments, he was right: many were cast, but
few retrieved.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Wednesday, August 12, 2009 8:40 AM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

Hi Inge,

Common misconception, but IBM did not invent column grid arrays, but
Bell Labs did [there are patents to proof it]. The difference is that
Bell Labs columns where cast, not soldered wires.

Werner


-----Original Message-----
From: Inge <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Aug 11, 2009 5:42 pm
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING



IBM invented them, but did they ever use them ??
Inge?
?
----- Original Message ----- From: "David D. Hillman"
<[log in to unmask]>?
To: <[log in to unmask]>?
Sent: Tuesday, August 11, 2009 11:23 PM?
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING?
?
> Hi Lee - Run............ run for the hills! A Column grid array
package is?
> like having a BGA with coplanarity problems! The CGA are not
impossible to?
> deal with but you do need to make sure that your stencil print
operation?
> and solder paste volume values are repeatable and consistent. Also
check?
> to see that the CGA in the trays do not have bent columns before you?
> attempt to place them. Good Luck.?
>?
> Dave Hillman?
> Rockwell Collins?
> [log in to unmask]
>?
>?
>?
>?
> Lee Whiteman <[log in to unmask]>?
> Sent by: TechNet <[log in to unmask]>?
> 08/11/2009 04:02 PM?
> Please respond to?
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to?
> [log in to unmask]
>?
>?
> To?
> [log in to unmask]
> cc?
>?
> Subject?
> [TN] HDI AND COLUMN GRID ARRAY PACKAGING?
>?
>?
>?
>?
>?
>?
> We may be using column grid array packaging with ENIG finished High?
> Density Interconnect (HDI) boards. Are there any ground rules for
using?
> this type of technology??
>?
> Lee Whiteman, PMP?
> Senior Member Engineering Staff?
> L-3 Communications East
?
> Telephone: (856) 338-3508?
> FAX: (856) 338-2906?
> E-Mail: [log in to unmask]
>?
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