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August 2009

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 12 Aug 2009 11:48:35 -0400
Content-Type:
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Hi Dean,

Better modulus of elesticity has nothing to do with it, it is the column height. Pb90 is used for its higher Liquidus temperature which allows it to be soldered with eutectic SnPb without melting and collapsing.

Werner


-----Original Message-----
From: Stadem, Richard D. <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Aug 11, 2009 5:56 pm
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING




Yes. The alumina oxide (ceramic) body dissipates heat better, but the
delta CTE between same body and FR-4 board types is much greater, thus
the use of Pb90 columns (better modulus of elasticity).

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, August 11, 2009 4:49 PM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

As far as I understand, they have two main benefits: well defined and 
extremly good heat transportation and withstand temp changes better than

anything else, is it so?

----- Original Message ----- 
From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>; "Inge" <[log in to unmask]>
Sent: Tuesday, August 11, 2009 11:45 PM
Subject: RE: [TN] HDI AND COLUMN GRID ARRAY PACKAGING


Yes. The IBM PowerPC package is one example. Millions of them out there.
They are very popular on Telecomm CCAs.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, August 11, 2009 4:43 PM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

IBM invented them, but did they ever  use them ?
Inge


----- Original Message ----- 
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 11, 2009 11:23 PM
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING


> Hi Lee - Run............ run for the hills! A Column grid array
package is
> like having a BGA with coplanarity problems! The CGA are not
impossible to
> deal with but you do need to make sure that your stencil print
operation
> and solder paste volume values are repeatable and consistent. Also
check
> to see that the CGA in the trays do not have bent columns before you
> attempt to place them. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Lee Whiteman <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/11/2009 04:02 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to

> [log in to unmask]
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] HDI AND COLUMN GRID ARRAY PACKAGING
>
>
>
>
>
>
> We may be using column grid array packaging with ENIG finished High
> Density Interconnect (HDI) boards. Are there any ground rules for
using
> this type of technology?
>
> Lee Whiteman, PMP
> Senior Member Engineering Staff
> L-3 Communications East
> Telephone: (856) 338-3508
> FAX: (856) 338-2906
> E-Mail: [log in to unmask]
>
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