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August 2009

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 12 Aug 2009 11:46:03 -0400
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Hi Inge,

The main benefit is the column height which?makes it possible?to attach ceramic BGAs to PCBs without the large CTE-mismatch causing failures too early.

Werner


-----Original Message-----
From: Inge <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Aug 11, 2009 5:49 pm
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING



As far as I understand, they have two main benefits: well defined and extremly good heat transportation and withstand temp changes better than anything else, is it so??
?
----- Original Message ----- From: "Stadem, Richard D." <[log in to unmask]>?
To: <[log in to unmask]>; "Inge" <[log in to unmask]>?
Sent: Tuesday, August 11, 2009 11:45 PM?
Subject: RE: [TN] HDI AND COLUMN GRID ARRAY PACKAGING?
?
Yes. The IBM PowerPC package is one example. Millions of them out there.?
They are very popular on Telecomm CCAs.?
?
-----Original Message-----?
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge?
Sent: Tuesday, August 11, 2009 4:43 PM?
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING?
?
IBM invented them, but did they ever use them ??
Inge?
?
----- Original Message ----- From: "David D. Hillman" <[log in to unmask]>?
To: <[log in to unmask]>?
Sent: Tuesday, August 11, 2009 11:23 PM?
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING?
?
> Hi Lee - Run............ run for the hills! A Column grid array?
package is?
> like having a BGA with coplanarity problems! The CGA are not?
impossible to?
> deal with but you do need to make sure that your stencil print?
operation?
> and solder paste volume values are repeatable and consistent. Also?
check?
> to see that the CGA in the trays do not have bent columns before you?
> attempt to place them. Good Luck.?
>?
> Dave Hillman?
> Rockwell Collins?
> [log in to unmask]
>?
>?
>?
>?
> Lee Whiteman <[log in to unmask]>?
> Sent by: TechNet <[log in to unmask]>?
> 08/11/2009 04:02 PM?
> Please respond to?
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to?
> [log in to unmask]
>?
>?
> To?
> [log in to unmask]
> cc?
>?
> Subject?
> [TN] HDI AND COLUMN GRID ARRAY PACKAGING?
>?
>?
>?
>?
>?
>?
> We may be using column grid array packaging with ENIG finished High?
> Density Interconnect (HDI) boards. Are there any ground rules for?
using?
> this type of technology??
>?
> Lee Whiteman, PMP?
> Senior Member Engineering Staff?
> L-3 Communications East?
> Telephone: (856) 338-3508?
> FAX: (856) 338-2906?
> E-Mail: [log in to unmask]
>?
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