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August 2009

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Wed, 12 Aug 2009 19:29:58 +0800
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text/plain (1 lines)
I once used Amphenol NeXLev® connector

(http://www.amphenol-tcs.com/products/connectors/mezzanine/nexlev/index.html)

No major issue for initial solder paste printing and assembly process

No able to rework the lead; have to use a new one.

Solder joints are good.

Localise rework (replacement with new) must ensure the heat is even distributed on board level from bottom side before "short full blaze" from the top heater. 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah

Sent: Wednesday, 12 August 2009 7:00 PM

To: [log in to unmask]

Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING connectors



Such connectors has disadvantageous :

1.	Coplanarity risk of some of the leads (no collapse is possible).

2.	Un able to rework the leads if needed

3.	Reliability of their solder joints.



Can someone share us with his experience with HDAM connectors of SAMTEC?





Best Regards



Reuven ROKAH 

e mail: [log in to unmask]

Think green before printing this mail... Thanks



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins

Sent: Wednesday, August 12, 2009 1:50 PM

To: [log in to unmask]

Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING



Yes.  15 years ago I was involved in a project (at a different employer

than now) - a 1024 column ceramic CGA memory controller on a mainframe

memory CCA.  Boy, that thing was awesome - 256 megs of memory in a case

the size of a big 3 ring binder.  :-) Thankfully the SMT assembly

process wasn't mine to worry about. The part did give that process

engineer some issues - notably that reworking them was difficult.



regards,

 - Graham



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge

Sent: Tuesday, August 11, 2009 6:43 PM

To: [log in to unmask]

Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING



IBM invented them, but did they ever  use them ?

Inge





----- Original Message ----- 

From: "David D. Hillman" <[log in to unmask]>

To: <[log in to unmask]>

Sent: Tuesday, August 11, 2009 11:23 PM

Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING





> Hi Lee - Run............ run for the hills! A Column grid array

package is

> like having a BGA with coplanarity problems! The CGA are not

impossible to

> deal with but you do need to make sure that your stencil print

operation

> and solder paste volume values are repeatable and consistent. Also

check

> to see that the CGA in the trays do not have bent columns before you

> attempt to place them. Good Luck.

>

> Dave Hillman

> Rockwell Collins

> [log in to unmask]

>

>

>

>

> Lee Whiteman <[log in to unmask]>

> Sent by: TechNet <[log in to unmask]>

> 08/11/2009 04:02 PM

> Please respond to

> TechNet E-Mail Forum <[log in to unmask]>; Please respond to

> [log in to unmask]

>

>

> To

> [log in to unmask]

> cc

>

> Subject

> [TN] HDI AND COLUMN GRID ARRAY PACKAGING

>

>

>

>

>

>

> We may be using column grid array packaging with ENIG finished High

> Density Interconnect (HDI) boards. Are there any ground rules for

using

> this type of technology?

>

> Lee Whiteman, PMP

> Senior Member Engineering Staff

> L-3 Communications East

> Telephone: (856) 338-3508

> FAX: (856) 338-2906

> E-Mail: [log in to unmask]

>

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