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August 2009

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Wed, 12 Aug 2009 13:20:04 +0200
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Me too. IBM in Boeblingen had built a wonderland for producing all kind of ceramic stuff for super computers. I  visited them many years ago to see if we were interested in buying the whole plant. Boeblingen plant was a technical wonder, as I said, but they were not in line with what happened at Intel. The development of processors was so rapid, that the need for multichip monsters vanished. Noone wanted the super plant, and that's the end of  a fantastic IBM saga. I still have some unbelieveable stuff in my archive, e.g. a 60-layer MCM with 50,000 solder pads! 
/Inge

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: onsdag 12 augusti 2009 12:50
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

Yes.  15 years ago I was involved in a project (at a different employer than now) - a 1024 column ceramic CGA memory controller on a mainframe memory CCA.  Boy, that thing was awesome - 256 megs of memory in a case the size of a big 3 ring binder.  :-) Thankfully the SMT assembly process wasn't mine to worry about. The part did give that process engineer some issues - notably that reworking them was difficult.

regards,
 - Graham

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, August 11, 2009 6:43 PM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

IBM invented them, but did they ever  use them ?
Inge


----- Original Message -----
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 11, 2009 11:23 PM
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING


> Hi Lee - Run............ run for the hills! A Column grid array
package is
> like having a BGA with coplanarity problems! The CGA are not
impossible to
> deal with but you do need to make sure that your stencil print
operation
> and solder paste volume values are repeatable and consistent. Also
check
> to see that the CGA in the trays do not have bent columns before you
> attempt to place them. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Lee Whiteman <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/11/2009 04:02 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> [log in to unmask]
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] HDI AND COLUMN GRID ARRAY PACKAGING
>
>
>
>
>
>
> We may be using column grid array packaging with ENIG finished High
> Density Interconnect (HDI) boards. Are there any ground rules for
using
> this type of technology?
>
> Lee Whiteman, PMP
> Senior Member Engineering Staff
> L-3 Communications East
> Telephone: (856) 338-3508
> FAX: (856) 338-2906
> E-Mail: [log in to unmask]
>
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