Solder volume is the key factor.
If you need to rework...you have to send back the package...
Need to apply paste (volume) on the board/ CGA to assembly a new CGA due
to defect..
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, 12 August 2009 5:23 AM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING
Hi Lee - Run............ run for the hills! A Column grid array package
is
like having a BGA with coplanarity problems! The CGA are not impossible
to
deal with but you do need to make sure that your stencil print operation
and solder paste volume values are repeatable and consistent. Also check
to see that the CGA in the trays do not have bent columns before you
attempt to place them. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
Lee Whiteman <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/11/2009 04:02 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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To
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Subject
[TN] HDI AND COLUMN GRID ARRAY PACKAGING
We may be using column grid array packaging with ENIG finished High
Density Interconnect (HDI) boards. Are there any ground rules for using
this type of technology?
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
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