Yes. Based on my knowledge. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Aug 11 17:42:59 2009
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

IBM invented them, but did they ever  use them ?
Inge


----- Original Message ----- 
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 11, 2009 11:23 PM
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING


> Hi Lee - Run............ run for the hills! A Column grid array package is
> like having a BGA with coplanarity problems! The CGA are not impossible to
> deal with but you do need to make sure that your stencil print operation
> and solder paste volume values are repeatable and consistent. Also check
> to see that the CGA in the trays do not have bent columns before you
> attempt to place them. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Lee Whiteman <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/11/2009 04:02 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> [log in to unmask]
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] HDI AND COLUMN GRID ARRAY PACKAGING
>
>
>
>
>
>
> We may be using column grid array packaging with ENIG finished High
> Density Interconnect (HDI) boards. Are there any ground rules for using
> this type of technology?
>
> Lee Whiteman, PMP
> Senior Member Engineering Staff
> L-3 Communications East
> Telephone: (856) 338-3508
> FAX: (856) 338-2906
> E-Mail: [log in to unmask]
>
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