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August 2009

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 11 Aug 2009 16:45:07 -0500
Content-Type:
text/plain
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text/plain (134 lines)
Yes. The IBM PowerPC package is one example. Millions of them out there.
They are very popular on Telecomm CCAs.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, August 11, 2009 4:43 PM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING

IBM invented them, but did they ever  use them ?
Inge


----- Original Message ----- 
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 11, 2009 11:23 PM
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING


> Hi Lee - Run............ run for the hills! A Column grid array
package is
> like having a BGA with coplanarity problems! The CGA are not
impossible to
> deal with but you do need to make sure that your stencil print
operation
> and solder paste volume values are repeatable and consistent. Also
check
> to see that the CGA in the trays do not have bent columns before you
> attempt to place them. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Lee Whiteman <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/11/2009 04:02 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> [log in to unmask]
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] HDI AND COLUMN GRID ARRAY PACKAGING
>
>
>
>
>
>
> We may be using column grid array packaging with ENIG finished High
> Density Interconnect (HDI) boards. Are there any ground rules for
using
> this type of technology?
>
> Lee Whiteman, PMP
> Senior Member Engineering Staff
> L-3 Communications East
> Telephone: (856) 338-3508
> FAX: (856) 338-2906
> E-Mail: [log in to unmask]
>
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