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August 2009

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 11 Aug 2009 17:02:46 -0400
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We may be using column grid array packaging with ENIG finished High
Density Interconnect (HDI) boards. Are there any ground rules for using
this type of technology?

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]

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