OK, as a working member of IEC TC91 team, I am coming out from behind
the parapet waving the white flag!!! DON'T SHOOT!
You mention DIN IEC 61191-1 which means that you are referring to the
German version. Each Nation that is part of the World Trade
Organisation has a vote on IEC standards including the IPC on behalf
of NIST.
If, as has been suggested, the document is a "direct copy" of J-
STD-001, I would check which revision - they may not be the same.
As regards measurments used in IEC - they are ALL metric and there is
good reason behind everything you read. So 2,5 µm = 2.5 µm or 2
point 5 micrometers or 2 point 5 microns.
Michael - does this help?
Graham Naisbitt
IEC AND IPC team helper.....
On 31 Jul 2009, at 18:05, Joyce Koo wrote:
> Who ever made doc and approved it should get shot at... seriously.
> Not a Friday joke.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeremias, Michael
> Sent: Friday, July 31, 2009 12:17 PM
> To: [log in to unmask]
> Subject: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD
> PERCENTAGE IN A SOLDER JOINT
>
> Unfortunately it is not (!) a typo from me . The document DIN EN
> 61191-1 contains this value 2,5 µm . But I am not confident, that
> this is low enough for any process cases so we use for PTH the
> same rule as above as mentioned below
> Sincerely
>
> Michael Jeremias
>
> -----Ursprüngliche Nachricht-----
> Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo
> Gesendet: Donnerstag, 30. Juli 2009 12:22
> An: [log in to unmask]
> Betreff: Re: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE
> IN A SOLDER JOINT
>
> Must be a typo. Should be 0.25 micron? 10 micro-inches?
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: TechNet <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Sent: Thu Jul 30 04:26:14 2009
> Subject: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A
> SOLDER JOINT
>
> IEC 61191-1
> chapter 6.2.2 contains the rules
> < 1,4% Volume Au, < 3% Wt Au in the final solder interconnection
> < 2,5 µm for PTH Wave soldering (I am not confident, that this
> is low enough for any process cases so we use for PTH the same rule
> as above)
>
> You have to take into consideration solder paste volume(stencil-
> thickness), wetted Au-surface, wetted Au thickness
>
> Own investigations show, that Au brittelness may occure from 1,6%
> Vol and really will occure from 2,3% Vol.
>
>
>
>
>
> Sincerly
>
> Michael Jeremias
> Industrial Engineering (OPPI41)
> Electronics Production
> ((( Defence Electronics
> EADS Deutschland GmbH
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