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August 2009

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Tue, 11 Aug 2009 08:51:39 -0400
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Hello Technos,

 

I have been asking questions on Technet about some wetting issues we see on a particular board and got many useful answers. In the end we've had the boards tested for solderability by respectable labs and the bare boards passed J-STD-003 testing with flying colors.

 

To back track a little bit, the original doubt came from the fact that in reflow, the solder does wet very well on both the board and the component in the component pin area, but would stop spreading pretty far from the land's end. It just stops spreading, even though the wetting angles at the stop points are very low, so denoting excellent wetting.

 

And here comes the question: why is testing per J-STD-003 done at 235 C and with a rather aggressive flux, when the reflow soldering takes place at 205 C (HASL finish) using a milder flux (I am using WS, but it could very well be no-clean...)?

 

Thanks,

 

Ioan Tempea, ing.

Ingénieur Principal Fabrication / Sr. Manufacturing Engineer 

 

 

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