While the subject matter has drifted this direction, it should be  pointed 
out that there is opportunity to share your insights, experiences  and 
observations relative the thorny issues of Bottom Terminated  Components (BTC) 
and specifically QFN and LGA assembly in the IPC-7093  document which is in 
early draft form. Those interested should check in  with the IPC staff or the 
committee chairman Ray Prasad for more  information.  The last meeting was 
last month in Oregon and a good  deal of progress was made. 
 
For the younger members of this forum, getting involved provides  a great 
opportunity to get an understanding of the standards system and how it  works 
and there is always need for "new blood" to carry on as others move  on or 
retire. It certainly won't hurt your stature in your job and in the  
industry and I am highly confident you won't regret getting  involved. 
 
There are many different IPC committee members and chairpersons who share  
their knowledge here regularly and their participation in these activities 
has  (I believe they will agree) contributed much to the growth and expansion 
of  much of the experience and knowledge which they share here. 
 
Joe

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