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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Mon, 10 Aug 2009 15:24:49 +0800
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Hi Grivon,
               There is some guide from Actel : http://www.actel.com/documents/QFN_AN.pdf which I don't think it will work well. Go for a volume of 55% at the thermal pad (and a pad opening of 9mils (5mils stencil thickness) with slight rounded radius at the corner of the opening. What is your problem and stencil openings? With your result, you will able to know where gone wrong. FYI, we used only two rows of QFN as of now and lots of LGAs. Hope it help.
 
Regards
GA Tan

________________________________

From: TechNet on behalf of GRIVON Arnaud
Sent: Fri 8/7/2009 6:04 PM
To: [log in to unmask]
Subject: Re: [TN] Actel QFN180 Assembly



Coming back on an old post from Steve (at his former employer...).
Does anybody have good stencil rules for the assembly of multi-row QFNs and
especially triple-row such as ACTEL QFN180?
Like Steve and probably many others, we tried to find the right aperture
balance between I/Os and central thermal pad without success...
A. Grivon

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