There are three books covering the subject
Area Array Interconnection by Karl Puttliz excellent holiday read
Area Array Packaging Hand Book, there are two by Ken Gilleo
Ball Grid Array Technology John Lau
IPC and SMTA have some inspection charts that cover optical and x-rays inspection
610 is going to cover CGA in the future
Many thanks and all the best on a wet day in UK
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
www.SolderingStandards.com
PCB Design for Manufacture & Assembly Workshop 15th October www.ASKbobwillis.com
PCB Inspection & Quality Control Workshop 3rd November www.ASKbobwillis.com/faworkshops.pdf
Book Bob's "Step by Step Failure Analysis Workshop" 4th November www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
Sent: 12 August 2009 12:00
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING connectors
Such connectors has disadvantageous :
1. Coplanarity risk of some of the leads (no collapse is possible).
2. Un able to rework the leads if needed
3. Reliability of their solder joints.
Can someone share us with his experience with HDAM connectors of SAMTEC?
Best Regards
Reuven ROKAH
e mail: [log in to unmask]
Think green before printing this mail... Thanks
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Wednesday, August 12, 2009 1:50 PM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING
Yes. 15 years ago I was involved in a project (at a different employer
than now) - a 1024 column ceramic CGA memory controller on a mainframe
memory CCA. Boy, that thing was awesome - 256 megs of memory in a case
the size of a big 3 ring binder. :-) Thankfully the SMT assembly
process wasn't mine to worry about. The part did give that process
engineer some issues - notably that reworking them was difficult.
regards,
- Graham
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, August 11, 2009 6:43 PM
To: [log in to unmask]
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING
IBM invented them, but did they ever use them ?
Inge
----- Original Message -----
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 11, 2009 11:23 PM
Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING
> Hi Lee - Run............ run for the hills! A Column grid array
package is
> like having a BGA with coplanarity problems! The CGA are not
impossible to
> deal with but you do need to make sure that your stencil print
operation
> and solder paste volume values are repeatable and consistent. Also
check
> to see that the CGA in the trays do not have bent columns before you
> attempt to place them. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Lee Whiteman <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/11/2009 04:02 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> [log in to unmask]
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] HDI AND COLUMN GRID ARRAY PACKAGING
>
>
>
>
>
>
> We may be using column grid array packaging with ENIG finished High
> Density Interconnect (HDI) boards. Are there any ground rules for
using
> this type of technology?
>
> Lee Whiteman, PMP
> Senior Member Engineering Staff
> L-3 Communications East
> Telephone: (856) 338-3508
> FAX: (856) 338-2906
> E-Mail: [log in to unmask]
>
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