Hi All,
Given the high interest within the industry in solder joint reliability
in general and given the current difficulties in traveling, I thought
some of you might be interested in three webcasts I will be giving on
this subject on September 15, 16 & 17. for details, please see the
attached IPC announcement.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
IPC Webcast: Series on Lead-Free Updates
September 15 — 17, 2009
10:00 am-11:00 am (Central time)
tuesday, September 15
Wednesday, September 16
thursday, September 17
20
The industry has grappled with the issue of solder joint reliability for the last 40 years. It took some 30 years to understand the creep-fatigue behavior of tin-lead solders. With the RoHS-mandated switch to lead-free, the reliability issue started anew with SAC alloys (tin, silver, copper) and other lead-free solders. While you can learn a lot about the reliability of SAC solders from our experience with tin-lead solders, there are important differences in both what is required for successful soldering processes and the way these lead-free solders behave.
The webcast Series on Lead-Free Updates provides the audience with basic information about underlying solder behavior and failure mechanisms. Fundamental understanding is essential during the design process, so that highly reliable assemblies can be manufactured on a repeatable basis. Failure modes and root cause analysis results will be shared during the Lead-Free Update webcasts. Lessons learned will help you manufacture more reliable products using lead-free technology. This will result in fewer products coming back from the field, improving the efficiency of operations and reducing penalty costs associated with returned goods.
Who Should Attend:
This webcast series is recommended for anybody concerned with the quality and reliability of electronic products, especially solder joint reliability. The webcasts are especia
lly important for managers and engineers involved with the design and manufacture of printed circuit assemblies.
Fundamentals in Solder Joint Reliability
Tuesday, September 15, 2009
The switch to lead-free solders has created a number of issues in the assembly process as well as with the long-term reliability of assemblies themselves. The threat to the reliability of electronic products comes from three sources: (1) solder joint reliability, (2) printed circuit board (PCB) survivability, and (3) component survivability. The potential damage to assemblies caused by the high temperatures required for most lead-free soldering processes can have an enormous effect on assembly integrity and reliability. During this webcast, various failure modes that have been observed will be highlighted, their underlying damage mechanisms will be defined as well as solution options.
The properties of lead-free solders, particularly SAC solders, can cause processing issues, including dissolution of base metals such as copper & increased stress due to different coefficients of thermal expansion and higher soldering temperatures. These issues will be examined together with their possible impacts on solder joint reliability. Both the short-term and long-term effects will be discussed during the webcast.
Root Cause Analysis of Solder Joint Failures
Wedn
esday, September 16, 2009
Stress is the primary root cause of solder joint failure. Higher temperatures required for the lead-free soldering process create a different stress-strain relationship than that for traditional leaded solders. Higher temperatures also stress components and printed circuit boards. The proper selection of components, boards, solder and process variables is critically important in the prevention of solder joint failures. The PCB and component resin systems need to be able to survive the soldering processes without thermal degradation and delamination. Assemblies that seemingly have survived the soldering processes may contain latent defects leading to early field failures. Many of these latent defects are traced back to processing conditions during assembly operations. Only if one is aware of possible failures can one take steps to prevent latent defects.
Solder Joint Reliability for Pb-Free Solders
Thursday, September 17, 2009
Understanding the physics of solder joint failure mechanisms and the probability of occurrence with tin-lead solders took more than 30 years to develop. The available information on the creep-fatigue behavior of lead-free solders is, as yet, barely adequate for the determination of acceleration factors and the development of creep-fatigue models for some SAC solders and inadequate for other lead-free solders.
The creep-fatigue reliability of SAC s
older joints has been shown not to be dramatically different from the reliability of tin-lead solder joints, at least for accelerated testing. Predicting solder joint reliability for products can now be done for some of the most common SAC solder alloys. Accelerated aging fatigue life of the most common SAC alloys is available and will be presented. For some of the non-standard lead-free solders, more data need to be developed before fatigue life can be predicted; however, recommended design considerations can be implemented today to mitigate the risk of solder joint failure in the future. This webcast will share some of the actions you can take today to avoid problems tomorrow.
About the Webcast Instructor:
Werner Engelmaier has more than 44 years experience in electronic packaging and interconnection technology. Known as Mr. Reliability in the industry, he is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. He serves as chairman of the IPC Product Reliability Committee.
Registration Information:
Webcast registrants will receive a link to download the materials along with the call-in telephone number 24 hours prior to the start of each webcast. Please feel free to make copies for all participants attending at your
location. Set up a conference room and attend with colleagues or log in from the convenience of your home. Audio will be provided via a conference call phone number and participants will need Internet access. Remember to check local times to make sure you don't miss a minute.
The registration fee for each webcast is $100 for IPC members and $125 for nonmembers. To register, complete the registration form online or fax it to +1 847-615-5661. For more information, please contact Tina Nerad at +1 847-597-2826. Note: Cancellations must be made one business day prior to the workshop in order to be eligible for a full refund. If the workshop is cancelled, participants will receive a full refund. If you are unable to attend, you may send a coworker in your place.
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