Nevermind - as soon as I hit send I realized we weren't talking about
BGAs.
Scott Post
Staff Manufacturing Engineer
Delphi
-----Original Message-----
From: Post, Scott E
Sent: Tuesday, August 25, 2009 3:18 PM
To: 'TechNet E-Mail Forum'
Subject: RE: [TN] x-ray to estimate solder voiding
What is your pry method? Whenever I've done this, both for SnPb and Pb
free, the majority of the balls end up pulling the pads right out of the
board. I'd say less than 10% of the joints break in the solder. I've
use the simple "bend it over the corner of the desk" method as well as
epoxying stubs to the board & component and pulling them apart with an
Instron at various speeds. More often than not the copper pads are torn
from the board.
Scott Post
Staff Manufacturing Engineer
Delphi
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, August 25, 2009 3:11 PM
To: [log in to unmask]
Subject: Re: [TN] x-ray to estimate solder voiding
Kevin, if you can sacrifice a sample, preying off the component is a
way to get a very exact way to study voids. If the voids are adjacent to
the solder pad, which is often the case, the separation use to be just
there. Very large components, e.g. superBGAs, can not be removed this
way, of course.
Inge
----- Original Message -----
From: "Glidden, Kevin" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 25, 2009 8:29 PM
Subject: [TN] x-ray to estimate solder voiding
I am looking to have a couple of PCBs x-rayed to estimate the solder
voiding on the bottom only center pad of an SMT component. Can anyone
recommend a place?
Off line answers OK.
Thank you,
Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.
Lebanon, NH 03766
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