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August 2009

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Wed, 5 Aug 2009 09:53:34 -0400
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TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
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Joyce Koo <[log in to unmask]>
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I thought 883 has something related to that. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Aug 05 08:15:47 2009
Subject: [TN] die base chip outs / fractures

Fellow TechNetters:

   Is there an IPC documents pertaining to acceptance of anomalies with
die.   I am see small cracks/chip out at the die to die attach region.
How much chip out/ crack is allowed?

Victor,

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