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July 2009

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 30 Jul 2009 06:22:15 -0400
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Must be a typo. Should be 0.25 micron? 10 micro-inches? 
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Jul 30 04:26:14 2009
Subject: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT

IEC 61191-1 
chapter  6.2.2 contains  the  rules
< 1,4% Volume Au, <  3% Wt Au in the final solder interconnection 
< 2,5 µm for  PTH Wave soldering  (I am not confident, that this   is low enough for any process cases so we use  for PTH the same rule as above)

You have to take into consideration solder paste volume(stencil-thickness), wetted Au-surface, wetted Au thickness

Own investigations  show, that Au brittelness may  occure from  1,6% Vol and really will occure from 2,3% Vol. 

 



Sincerly 

Michael Jeremias   
Industrial Engineering (OPPI41) 
Electronics Production 
((( Defence Electronics 
EADS Deutschland GmbH 
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