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Date: | Tue, 28 Jul 2009 16:40:37 +0100 |
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Greg and fellow Techies
I am in the process of submitting revisions to solder paste tests
called up in TM-650 and need your help.
In 2.4.43 Solder Ball - 2.4.45 Wetting and 2.4.46 Spread Tests, we
need to allow for lead-free alloys. In each of these there is a quoted
time:
"The reflow shall occur within 20 seconds after the specimen is placed
in contact with the hot plate."
The recommendation is to include the following:
"For lead-free solder pastes, the reflow time shall occur within 30
seconds after the specimen is placed in contact with the hot plate."
Does anyone out there in Techieland have any objections to this
proposed addition to each of these test methods?
Thanks in advance
Regards
Graham Naisbitt
Managing Director
E: [log in to unmask]
P: +44 12 5252 1500
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GEN3 SYSTEMS LIMITED
Incorporating Process Support Products
Unit B2, Armstrong Mall
Southwood Business Park
FARNBOROUGH
Hampshire GU14 0NR - UK
Engineering Reliability in Electronics
Registered Number: 4639449 (England & Wales). Registered Office as
above.
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