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July 2009

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Subject:
From:
"Glidden, Kevin" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Glidden, Kevin
Date:
Mon, 20 Jul 2009 15:30:08 -0400
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Peter,

One of the many items I've learned through Technet and am happy to pass on...

Palladium silver finished components have no copper or nickel barrier betweem the component substrate and the finish plating, and thus the finish plating will leach into the solder joint and leave no intermettallic between the solder joint and the component body, resulting in poor solder joint reliability.  This is exacerbated by the higher Pb-free reflow temperatures.

Kevin Glidden

-----Original Message-----
From: Peter L [mailto:[log in to unmask]]
Sent: Monday, July 20, 2009 1:36 PM
To: [log in to unmask]
Subject: [TN] Leadfree compatibility of Silver Palladium terminations?

Hi,

I am wondering if anyone has experienced issues with leadfree reflow soldering
small discrete chips (0805) with silver palladium terminations? According to one
particular manufacturer (EPCOS) they do not approve it and claim that the
termination will be "damaged" under leadfree processing temperature. I am
curious to know the reason behind. Thanks.


http://www.epcos.com/web/generator/Web/Sections/ProductCatalog/Protectio
nDevices/CeramicTransientVoltageSuppressors/PDF/CTVS__Soldering,property=
Data__en.pdf;/CTVS_Soldering.pdf

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