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Subject:	ESD failure difference between 16-QSOP and 16-SOIC Video Buffer
From:	Toby Carrier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Toby Carrier <[log in to unmask]>
Date:	Fri, 17 Jul 2009 12:51:15 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

Hi,

Does anyone have an idea why a 16-SOIC Video buffer would pass ESD 
testing with being kludged in, compared to a 16-QSOP package of the same 
part actually soldered to the PCB? The SOIC part passes a Chassis and 
Common ground Air Gap event up to 25kV, but the QSOP part has failures on 
both chassis and common at 1kV and less? I would appreciate any articles or 
explanations that you might have.

Thanks

Toby Carrier
Engineering Technician

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