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July 2009

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 9 Jul 2009 16:32:06 -0500
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Hi Victor - here is the reference material I promised to send out. It is a 
paper from the 1996 SMI proceedings that Rockwell Collins and ECI
Technologies published. The "version" of ENEPIG we investigated had good
solderability and outstanding gold wirebondability.



Dave



Victor Hernandez <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/08/2009 08:31 AM
Please respond to
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Subject
Re: [TN] Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)






Dave,

   Can you share the reference material that you state in this note
concerning the above stated topic. I want to be knowledgeable of the
process versus hard gold and pure ENIG for commercial use.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, April 23, 2009 10:41 PM
To: [log in to unmask]
Subject: Re: [TN] Electroless Nickel Electroless Palladium Immersion
Gold (ENEPIG)

Hi Lee - ENEPIG is a very good finish - look up the 1996 SMI conference
proceedings where Rockwell published a paper on the topic. One of the
big
drawbacks of the finish is its cost. There are a couple of good
reference
books that talk about ENEPIG. When I get back off business travel, I can

send your the exact references.

Dave Hillman
Rockwell Collins
[log in to unmask]




Lee Whiteman <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04/23/2009 01:11 PM
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Subject
[TN] Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)






Does anyone have any opinions of using Electroless Nickel Electroless
Palladium Immersion Gold (ENEPIG) as a board finish for high reliability
aerospace applications?

You can contact me off line if necessary...

Thanks again.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

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