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July 2009

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Subject:
From:
Gabriela <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gabriela <[log in to unmask]>
Date:
Sat, 4 Jul 2009 10:54:23 +0300
Content-Type:
text/plain
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text/plain (42 lines)
Dear all,
By cross sectioning BGA solder joints on a failed assembly, I found that the
suspected joints are not uniform and that they contain unusual separation
areas.

I suspect mixed assembly and/or bad reflow profile.

Steve was so kind and enabled me to send the links.
Please may I have your opinion?
http://stevezeva.homestead.com/files/small.jpg

 

 <http://stevezeva.homestead.com/files/small1.jpg>
http://stevezeva.homestead.com/files/small1.jpg

 

 <http://stevezeva.homestead.com/files/small2.jpg>
http://stevezeva.homestead.com/files/small2.jpg

http://stevezeva.homestead.com/files/small3.jpg

 <http://stevezeva.homestead.com/files/small4.jpg>
http://stevezeva.homestead.com/files/small4.jpg

 


Gaby


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