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July 2009

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Subject:
Re: Via plating question
From:
Donald Vischulis <[log in to unmask]>
Reply To:
Donald Vischulis <[log in to unmask]>
Date:
Thu, 30 Jul 2009 16:35:02 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (48 lines) 
Shawn



Remember that a .015 dia finished via with a minimum of .001 plated copper is about equal to a .036 wide trace in one ounce copper (.0014 thick) or a .018 wide trace in two ounce copper (.0028 thick).



I used Pi divided by 4 times the quantity (diameter 1 squared minus diameter 2 squared ) to calculate the area of the annulus inside the hole then divided by the surface thickness.   Sorry I can't get the equation to print.  Assumptions: .015 dia finished hole and .017 dia drilled hole.



Don Vischulis



-----Original Message-----

>From: "Upton, Shawn" <[log in to unmask]>

>Sent: Jul 30, 2009 9:05 AM

>To: [log in to unmask]

>Subject: [TN] Via plating question

>

>Quick question: I usually have via's plated to a minimum of 1mil.  I

>have a high current design where I'd like to have those via's plated to

>2mil (near 2oz, to match the 2oz spec for the layers) -- but the board

>has some 15mil vias and is a 125mil thick board.  Would a typical board

>house be ok with this?  I don't care about getting those 15mil mil

>diameter via's to 2mil barrel plating, only the 32mil ones need to be

>that thick.

>

>Shawn Upton, KB1CKT

>Test Engineer

>Allegro MicroSystems, Inc

>[log in to unmask]

>603.626.2429/fax: 603.641.5336

>

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