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July 2009

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Subject:
From:
Roger Stoops <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roger Stoops <[log in to unmask]>
Date:
Thu, 30 Jul 2009 15:41:52 -0400
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And don't forget that 2 mils in vias translates to at least 2 mils on the
outer layers... Is it possible to double-up on vias if impedance is an
issue?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tony Steinke
Sent: Thursday, July 30, 2009 10:18 AM
To: [log in to unmask]
Subject: Re: [TN] Via plating question

It is difficult but it can be done. $$$$

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Upton, Shawn
Sent: Thursday, July 30, 2009 10:06 AM
To: [log in to unmask]
Subject: [TN] Via plating question

Quick question: I usually have via's plated to a minimum of 1mil.  I
have a high current design where I'd like to have those via's plated to
2mil (near 2oz, to match the 2oz spec for the layers) -- but the board
has some 15mil vias and is a 125mil thick board.  Would a typical board
house be ok with this?  I don't care about getting those 15mil mil
diameter via's to 2mil barrel plating, only the 32mil ones need to be
that thick.

Shawn Upton, KB1CKT
Test Engineer
Allegro MicroSystems, Inc
[log in to unmask]
603.626.2429/fax: 603.641.5336

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