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TECHNET  July 2009

TECHNET July 2009

Subject:

Re: FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT

From:

Werner Engelmaier /* <[log in to unmask]>

Reply-To:

TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask][log in to unmask]

Date:

Wed, 29 Jul 2009 13:52:59 -0400

Content-Type:

text/plain

Parts/Attachments:

Parts/Attachments

text/plain (674 lines)

 Hi Dean,
Good luck, indeed.
Werner


 


 

-----Original Message-----
From: Stadem, Richard D. <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Sent: Wed, Jul 29, 2009 1:47 pm
Subject: RE: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT










Werner,
Just by your answer to Inge, it proves you are still a sound and practical guy. 
Probably always will be, provided you don't get overheated on the golf course 
while the rest of us work to keep our jobs.

I had to do a lot of work on this issue while working for Honeywell, and I found 
out (painfully) that the weight percentage approach alone does not 
prove/disprove a gold embrittlement issue will or will not occur. It can happen 
with as little as 1% gold by volume. 
There are many other factors involved, including the shape of the SJs.

And all, once again, remember this is a time-variable phenomena. Nucleation of 
gold through the SJ takes time. Soldering of gold-plated leads to a circuit 
board and then performing immediate pull-testing means nothing.

This is the reason that paragraph 3.9.3 of J-STD-001D states what it does. And 
if you need to build Space product (per J-STD-001DS), the rules are even more 
stringent; you cannot solder any part containing any amount of gold on the 
solderable portion of the leads, it must be removed. The only exception is if 
you can prove with "documented objective evidence available for review that 
there are no gold-related solder embrittle
ment problems associated with the 
soldering process being used."
Good luck with that.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Wednesday, July 29, 2009 11:54 AM
To: [log in to unmask]
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT


 Hi Inge,
No 'used to be-—I think I still am.
If you read my resposes you find that I do not think much of this wt-% 
approach—and it has nothing to do with the impracticality of it after the fact.
Werner


 


 

-----Original Message-----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; [log in to unmask]
Sent: Wed, Jul 29, 2009 12:41 pm
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT









Werner, 
 

You use to be a sound and practical guy. How on earth can you decide the 
volume %-age of the Au brittle phase content in solder joints. Only way is 
chemical analysis of some kind, but how do you know then the weight % of 
respective AuSn phase? 

/Inge 
 


----- Original Message ----- 
From: "Werner Engelmaier /*" <[log in to unmask]> 

To: <[log in to unmask]> 

Sent: Wednesday, July 29, 2009 3:07 PM 

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT 
 

 

Hi Inge, 

How on earth did you find this gem? 

Not only does it say all that needs to be said to avoid Au-embrittlement, 
but it also points=2
0out the misgivings about 

ENIG which certainly have been experienced by many. 

Too bad, we have not heard from the 'Moon Man' in years—thank god we still 
get 'tuppence' from Brian. 

Werner 
 

 

 

 

 


-----Original Message----- 

From: Inge <mm24727@mu
lle.swipnet.se> 

To: TechNet E-Mail Forum <[log in to unmask]>; [log in to unmask] 

Sent: Wed, Jul 29, 2009 3:39 am 

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT 
 

 

 

 

 

Interesting discussion between Brian Ellis and Earl Moon 11 years ago: 
 

/Inge 
 


http://dev.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=2345&#Message9513 
 

 

 

 

 

 

 


----- Original Message ----- 
From: "Werner Engelmaier /*" <[log in to unmask]> 
 

To: <[log in to unmask]> 
 

Sent: Wednesday, July 29, 2009 1:20 AM 
 

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT 
 

 

Hi Thomas, 
 

The attached will have to do. 
 


Werner 
 

Future webinars: 
 

September 15, “Fundamentals in Solder Joint Reliability” 
 

September 16, “Root Cause Analysis of Solder Joint Failures” 
 

September 17, “Solder Joint Reliability for Pb-Free Solders” 
 

Future workshops: 
 

September 24, IPC Midwest, Schaumburg, IL E2Fundamentals in Solder Joint 

Re 

liability” 
 

 

 

 

 

-----Original Message-----  

From: Gervascio, Thomas L <[log in to unmask]> 
 

To: [log in to unmask] 
 

Sent: Tue, Jul 28, 2009 6:42 pm 
 

Subject: Re: [TN] FORMULA FOR=2
0DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT 
 

 

 

 

 

 

How could I get a copy of it? I thought EP&P was out of print.. 
 


-----Original Message-----  

From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman 
 

Sent: Tuesday, July 28, 2009 10:01 AM 
 

To: [log in to unmask] 
 

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER 
 

JOINT 
 


Hi Jon - the folks from Lockheed published a very good article on the 
 

impact of gold on solder joints including the calculations/material 
 

parameters/graphs that would be useful to you. Pull a copy of this 
 

article: "Effects of Gold Diffusion on a Near Eutectic Solder Joint", S. 
 


Enwright, Electronic Packaging & Production, June 1998, pp 68-72. Good 
 

Luck. 
 


Dave Hillman 
 

Rockwell Collins 
 

[log in to unmask] 
 

 

 

"Roberts, Jon (SA-1)" <[log in to unmask]> 
 

Sent by: TechNet <[log in to unmask]> 
 

07/28/2009 07:53 AM 
 

Please respond to 
 

TechNet E-
Mail Forum <[log in to unmask]>; Please respond to 
 

"Roberts, Jon ( 
 

SA-1)" <[log in to unmask]> 
 

 

To 
 

[log in to unmask] 
 

cc 
 


Subject 
 

[TN] FORMULA FOR DETERMININ 

G GOLD PERCENTAGE IN A SOLDER JOINT 
 

 

 


 

Does anyone have or know where to find the formula for determining the 
 

amount of percentage of gold in a SMT solder joint?  Appreciate any 
 

help, Jon 
 

 

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