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Subject:	Re: FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
From:	Inge <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:	Wed, 29 Jul 2009 18:41:49 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (404 lines)
Werner,

You use to be a sound and practical guy. How on earth can you decide the 
volume %-age of the Au brittle phase content in solder joints. Only way is 
chemical analysis of some kind, but how do you know then the weight % of 
respective AuSn phase?
/Inge


----- Original Message ----- 
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, July 29, 2009 3:07 PM
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT



Hi Inge,
How on earth did you find this gem?
Not only does it say all that needs to be said to avoid Au-embrittlement, 
but it also points out the misgivings about
ENIG which certainly have been experienced by many.
Too bad, we have not heard from the 'Moon Man' in years—thank god we still 
get 'tuppence' from Brian.
Werner










-----Original Message-----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; [log in to unmask]
Sent: Wed, Jul 29, 2009 3:39 am
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT









Interesting discussion between Brian Ellis and Earl Moon 11 years ago:

/Inge


http://dev.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=2345&#Message9513














----- Original Message ----- 
From: "Werner Engelmaier /*" <[log in to unmask]>

To: <[log in to unmask]>

Sent: Wednesday, July 29, 2009 1:20 AM

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT



Hi Thomas,

The attached will have to do.


Werner

Future webinars:

September 15, “Fundamentals in Solder Joint Reliability”

September 16, “Root Cause Analysis of Solder Joint Failures”

September 17, “Solder Joint Reliability for Pb-Free Solders”

Future workshops:

September 24, IPC Midwest, Schaumburg, IL “Fundamentals in Solder Joint
Re
liability”









-----Original Message----- 

From: Gervascio, Thomas L <[log in to unmask]>

To: [log in to unmask]

Sent: Tue, Jul 28, 2009 6:42 pm

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT











How could I get a copy of it? I thought EP&P was out of print..


-----Original Message----- 

From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman

Sent: Tuesday, July 28, 2009 10:01 AM

To: [log in to unmask]

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER

JOINT


Hi Jon - the folks from Lockheed published a very good article on the

impact of gold on solder joints including the calculations/material

parameters/graphs that would be useful to you. Pull a copy of this

article: "Effects of Gold Diffusion on a Near Eutectic Solder Joint", S.


Enwright, Electronic Packaging & Production, June 1998, pp 68-72. Good

Luck.


Dave Hillman

Rockwell Collins

[log in to unmask]





"Roberts, Jon (SA-1)" <[log in to unmask]>

Sent by: TechNet <[log in to unmask]>

07/28/2009 07:53 AM

Please respond to

TechNet E-Mail Forum <[log in to unmask]>; Please respond to

"Roberts, Jon (

SA-1)" <[log in to unmask]>



To

[log in to unmask]

cc


Subject

[TN] FORMULA FOR DETERMININ
G GOLD PERCENTAGE IN A SOLDER JOINT







Does anyone have or know where to find the formula for determining the

amount of percentage of gold in a SMT solder joint?  Appreciate any

help, Jon



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