Brian&Earl have extraordinary insight in many processes, also, they have a
wonderful way of explaining to stupid people, like me. Therefore, I have
saved some gems. Another article that I like is the below one. It's not like
many papers, that are so academic, that you get nothing out of them,
instead, with this article you are able to understand in one sweep. The
author underlines a view that I myself use to point at:
avoid -Au -embrittlement- hysteria. Gold rich solder joints are not ALWAYS a
problem. If you have temp cycle requirements in the MIL range and you have
promised your customer that your product will withstand thousands of temp
cycles, or if you have extrem CTE mismatching, you may be right to be afraid
of gold, but there are many products with a steady and comfortable life, in
such cases gold rich solder joints may cause no problems at all.
/Inge
http://www.nokia.com/library/files/docs/peng_s20p1C.pdf
----- Original Message -----
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, July 29, 2009 3:07 PM
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
Hi Inge,
How on earth did you find this gem?
Not only does it say all that needs to be said to avoid Au-embrittlement,
but it also points out the misgivings about
ENIG which certainly have been experienced by many.
Too bad, we have not heard from the 'Moon Man' in years—thank god we still
get 'tuppence' from Brian.
Werner
-----Original Message-----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; [log in to unmask]
Sent: Wed, Jul 29, 2009 3:39 am
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
Interesting discussion between Brian Ellis and Earl Moon 11 years ago:
/Inge
http://dev.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=2345&#Message9513
----- Original Message -----
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, July 29, 2009 1:20 AM
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
Hi Thomas,
The attached will have to do.
Werner
Future webinars:
September 15, “Fundamentals in Solder Joint Reliability”
September 16, “Root Cause Analysis of Solder Joint Failures”
September 17, “Solder Joint Reliability for Pb-Free Solders”
Future workshops:
September 24, IPC Midwest, Schaumburg, IL “Fundamentals in Solder Joint
Re
liability”
-----Original Message-----
From: Gervascio, Thomas L <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Jul 28, 2009 6:42 pm
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT
How could I get a copy of it? I thought EP&P was out of print..
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, July 28, 2009 10:01 AM
To: [log in to unmask]
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER
JOINT
Hi Jon - the folks from Lockheed published a very good article on the
impact of gold on solder joints including the calculations/material
parameters/graphs that would be useful to you. Pull a copy of this
article: "Effects of Gold Diffusion on a Near Eutectic Solder Joint", S.
Enwright, Electronic Packaging & Production, June 1998, pp 68-72. Good
Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Roberts, Jon (SA-1)" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/28/2009 07:53 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Roberts, Jon (
SA-1)" <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] FORMULA FOR DETERMININ
G GOLD PERCENTAGE IN A SOLDER JOINT
Does anyone have or know where to find the formula for determining the
amount of percentage of gold in a SMT solder joint? Appreciate any
help, Jon
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