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July 2009

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 29 Jul 2009 09:07:20 -0400
Content-Type:
text/plain
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text/plain (372 lines)
 
Hi Inge,
How on earth did you find this gem?
Not only does it say all that needs to be said to avoid Au-embrittlement, but it also points out the misgivings about 
ENIG which certainly have been experienced by many.
Too bad, we have not heard from the 'Moon Man' in years—thank god we still get 'tuppence' from Brian.
Werner


 


 


 

-----Original Message-----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; [log in to unmask]
Sent: Wed, Jul 29, 2009 3:39 am
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT









Interesting discussion between Brian Ellis and Earl Moon 11 years ago: 

/Inge 
 

http://dev.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=2345&#Message9513 
 

 

 

 

 

 

 

----- Original Message ----- 
From: "Werner Engelmaier /*" <[log in to unmask]> 

To: <[log in to unmask]> 

Sent: Wednesday, July 29, 2009 1:20 AM 

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT 
 


Hi Thomas, 

The attached will have to do. 
 

Werner 

Future webinars: 

September 15, “Fundamentals in Solder Joint Reliability” 

September 16, “Root Cause Analysis of Solder Joint Failures” 

September 17, “Solder Joint Reliability for Pb-Free Solders” 

Future workshops: 

September 24, IPC Midwest, Schaumburg, IL “Fundamentals in Solder Joint 
Re
liability” 
 

 

 

 


-----Original Message----- 

From: Gervascio, Thomas L <[log in to unmask]> 

To: [log in to unmask] 

Sent: Tue, Jul 28, 2009 6:42 pm 

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT 
 

 

 

 

 


How could I get a copy of it? I thought EP&P was out of print.. 
 

-----Original Message----- 

From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman 

Sent: Tuesday, July 28, 2009 10:01 AM 

To: [log in to unmask] 

Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER 

JOINT 
 

Hi Jon - the folks from Lockheed published a very good article on the 

impact of gold on solder joints including the calculations/material 

parameters/graphs that would be useful to you. Pull a copy of this 

article: "Effects of Gold Diffusion on a Near Eutectic Solder Joint", S. 
 

Enwright, Electronic Packaging & Production, June 1998, pp 68-72. Good 

Luck. 
 

Dave Hillman 

Rockwell Collins 

[log in to unmask] 
 

 


"Roberts, Jon (SA-1)" <[log in to unmask]> 

Sent by: TechNet <[log in to unmask]> 

07/28/2009 07:53 AM 

Please respond to 

TechNet E-Mail Forum <[log in to unmask]>; Please respond to 

"Roberts, Jon ( 

SA-1)" <[log in to unmask]> 
 


To 

[log in to unmask] 

cc 
 

Subject 

[TN] FORMULA FOR DETERMININ
G GOLD PERCENTAGE IN A SOLDER JOINT 
 

 

 


Does anyone have or know where to find the formula for determining the 

amount of percentage of gold in a SMT solder joint?  Appreciate any 

help, Jon 
 


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