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July 2009

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Subject:
From:
"Gervascio, Thomas L" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gervascio, Thomas L
Date:
Tue, 28 Jul 2009 18:42:06 -0400
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How could I get a copy of it? I thought EP&P was out of print..

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, July 28, 2009 10:01 AM
To: [log in to unmask]
Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER
JOINT

Hi Jon - the folks from Lockheed published a very good article on the
impact of gold on solder joints including the calculations/material
parameters/graphs that would be useful to you. Pull a copy of this
article: "Effects of Gold Diffusion on a Near Eutectic Solder Joint", S.

Enwright, Electronic Packaging & Production, June 1998, pp 68-72. Good
Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




"Roberts, Jon (SA-1)" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/28/2009 07:53 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Roberts, Jon (SA-1)" <[log in to unmask]>


To
[log in to unmask]
cc

Subject
[TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT






Does anyone have or know where to find the formula for determining the
amount of percentage of gold in a SMT solder joint? Appreciate any
help, Jon


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