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July 2009

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TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Tue, 28 Jul 2009 21:29:18 +0200
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Master Stadem, you will get a award one day for your well-reasoned and 
incontrovertible sayings. Solid as a rock, whatever you say.

Inge

----- Original Message -----
From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 28, 2009 8:19 PM
Subject: Re: [TN] Solder Paste test method mods


Too add something further, I think that the test methods should be using
a specific reflow profile for solder paste in conjunction with one of
the IPC or Heraeus Benchmarker II test boards, rather than the
antiquated hot plate method.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, July 28, 2009 12:58 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste test method mods

Yes. Some fluxes transfer heat much more readily than others. Not all
fluxes are designed to burn off prior to reflow taking place, whether as
a standalone flux or as part of solder paste.
But I agree that the amount of time is irrelevant; the complete
agglomeration (no spitting or congealing) of the deposit is what is
critical in the agglomeration test on ceramic or FR-4, and the degree of
wetting spread once the paste reaches temperatures above the melting
point is what is critical on the wetting test on bare copper. The
variation in test apparatus is too widespread to make the time it takes
part of a requirement.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, July 28, 2009 12:47 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste test method mods

Is time to reflow really dependent upon the flux type? I agree with the
others - mass, geometry, and of course the alloy metallurgy.

Kevin

-----Original Message-----
From: Inge [mailto:[log in to unmask]]
Sent: Tuesday, July 28, 2009 1:29 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste test method mods

Graham,

I can't see the purpose of such a requirement. Time to reflow is
dependent
on the hotplate's surface condition, the contact surface geometry, used
flux
and maybe more factors. I have never seen any useful investigations,
nor
any papers on this matter. The time to reflow on a hotplate...what is
the
need of that? Heat transfer varies from machine to machine, from process
to
process.

Inge

----- Original Message -----
From: "Graham Naisbitt" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 28, 2009 5:40 PM
Subject: [TN] Solder Paste test method mods


> Greg and fellow Techies
>
> I am in the process of submitting revisions to solder paste tests
called
> up in TM-650 and need your help.
>
> In 2.4.43 Solder Ball - 2.4.45 Wetting and 2.4.46 Spread Tests, we
need
> to allow for lead-free alloys. In each of these there is a quoted
time:
>
> "The reflow shall occur within 20 seconds after the specimen is placed
in
> contact with the hot plate."
>
> The recommendation is to include the following:
>
> "For lead-free solder pastes, the reflow time shall occur within 30
> seconds after the specimen is placed in contact with the hot plate."
>
> Does anyone out there in Techieland have any objections to this
proposed
> addition to each of these test methods?
>
> Thanks in advance
>
> Regards
>
> Graham Naisbitt
> Managing Director
>
> E: [log in to unmask]
> P: +44 12 5252 1500
> F: +44 12 5252 1112
> W: www.gen3systems.com
>
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