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July 2009

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TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Tue, 28 Jul 2009 19:29:01 +0200
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Graham,

I can't see the purpose of such a requirement. Time to reflow is dependent
on the hotplate's surface condition, the contact surface geometry, used flux
and maybe more factors. I have never seen any useful investigations, nor
any papers on this matter. The time to reflow on a hotplate...what is the
need of that? Heat transfer varies from machine to machine, from process to
process.

Inge

----- Original Message -----
From: "Graham Naisbitt" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 28, 2009 5:40 PM
Subject: [TN] Solder Paste test method mods


> Greg and fellow Techies
>
> I am in the process of submitting revisions to solder paste tests called
> up in TM-650 and need your help.
>
> In 2.4.43 Solder Ball - 2.4.45 Wetting and 2.4.46 Spread Tests, we need
> to allow for lead-free alloys. In each of these there is a quoted time:
>
> "The reflow shall occur within 20 seconds after the specimen is placed in
> contact with the hot plate."
>
> The recommendation is to include the following:
>
> "For lead-free solder pastes, the reflow time shall occur within 30
> seconds after the specimen is placed in contact with the hot plate."
>
> Does anyone out there in Techieland have any objections to this proposed
> addition to each of these test methods?
>
> Thanks in advance
>
> Regards
>
> Graham Naisbitt
> Managing Director
>
> E: [log in to unmask]
> P: +44 12 5252 1500
> F: +44 12 5252 1112
> W: www.gen3systems.com
>
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>
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