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Subject:
From:
roland jaquet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, roland jaquet <[log in to unmask]>
Date:
Mon, 27 Jul 2009 17:22:53 +0200
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I need advise in a case where the outer layers have blind Via-in-pad (BGAs)
from lay14 to 13 and 1 to 2. Those were plated and filled-up with
non-conductive. 
What is the acceptable level for non-uniformity of the capping? 

I have 4 pictures to shareat following address:

http://www.pcbspecialist.com/PCBpics/RJ_00157.jpg
http://www.pcbspecialist.com/PCBpics/RJ_00158.jpg
http://www.pcbspecialist.com/PCBpics/RJ_00159.jpg
http://www.pcbspecialist.com/PCBpics/RJ_00160.jpg 

From the IPC-6016 (HDI) I got relevant :

3.5.3.2 Surface Mount Lands (Area for attachment such as solder, TAB,
conductive adhesive) Defects such as nicks, dents, and pinholes along the
edge of the land (length or width) shall not exceed that identified in the
respective slash sheets.

Slash sheet says "As Specified" and there is no customer requirement.. 

3.6.4 Filled Vias Buried vias and/or buried microvias shall be filled and
inspected in accordance with the procurement documentation. Blind vias on
the external layers do not have any fill requirements.



The PCBs have been manufactured as Class 2.

What is your opinion? 
Is there more documents I could base on for acceptability?

Thank you for your help 

Meilleures salutations
Very Best Regards
Roland

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